The Best Laptop Cpu Thermal Paste

Feature

• [BETTER THAN LIQUID METAL]: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
• [SAFE APPLICATION]: The MX-4 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
• [HIGH DURABILITY]: In contrast to metal and silicon thermal compound, the MX-4 does not compromise over time. Once applied, you do not need to apply it again as it will last at least for 8 years.
• [EASY TO APPLY]: With an ideal consistency, the MX-4 is very easy to use, even for beginners.
• [THERMAL COMPOUND]: Formula, the MX-4 guarantees exceptional heat dissipation from the components and supports the stability needed to push your system to its limit.

Feature

• WELL PROVEN QUALITY: The design of our thermal paste packagings has changed several times over the years. The formula of the composition has remained unchanged, so our MX pastes have stood for high performance and quality for years
• HIGH PERFORMANCE: With excellent temperature reduction performance, the MX-4 is ideal for CPU and GPU cooling, and other applications between power semiconductor components and heatsinks
• SAFE APPLICATION: The MX-4 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards
• HIGH DURABILITY: In contrast to metal and silicon thermal compound, the MX-4 does not compromise over time. Once applied, you do not need to apply it again as it will last at least for 8 years
• EASY TO APPLY: With an ideal consistency, the MX-4 is very easy to use, even for beginners

Feature

• The new version of the #1 bestseller: the MX-4 Edition 2019 convinces everyone with its usual quality and performance, that have always distinguished it
• Better than liquid metal: composed of carbon micro-particles which lead to an extremely high thermal conductivity. It s that heat generated from the CPU or GPU is dissipated efficiently
• Thermal compound: The MX-4 Edition 2019 formula S exceptional heat dissipation from the components and supports the stability needed to push your system to its limit
• Safe application: The MX-4 Edition 2019 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards
• High durability: in contrast to metal and silicon thermal compound, The MX-4 Edition 2019 doesn’t compromise over time. Once applied, you do not need to apply it again as it will last At least for 8 years

Feature

Feature

• Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles.
• Its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability
• Bonus Tool will come in handy rather then getting your hands dirty
• 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core
• Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003″ thick, the 3.5 gram syringe will cover approximately 16 square inches.

Feature

• Made of high-density filling of micronized silver and enhanced thermally conductive ceramic particles.
• Controlled Triple-Phase Viscosity
• Not Electrically Conductive
• Absolute Stability

Feature

• · Enthusiast CPU Thermal Compound: Premium Zinc Oxide based thermal compound for optimal thermal performance.
• · Cools your CPU and GPU: Install new, or replace existing thermal compound on your CPU and GPU to improve heat transfer and lower temperatures.
• · Improved CPU Cooling: Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
• · Installation Made Easy: An included application stencil and spreader take the guesswork out of applying XTM50 to your CPU cooler.
• · Filling the Gap: XTM50’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
• ·  Long Service Life: XTM50’s high-stability liquid compound lasts for years with no drying, cracking or change in consistency.
• · Safe For You And Your PC: Non-conductive and contains zero volatile compounds.

Feature

• 1-pack of 4 g Premium polysynthetic thermal compound,it’s :can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dispatch of your processor
• High stability & reliability polysynthetic thermal compound . non-volatile, non-corrosive, non-toxic, flame retardant
• High temperature resistance
• Easy apply to CPU & heatsinks or water-cooling solutions, Helps disperse heat from CPU to heatsink effectively.

Feature

• Thermal Grease Paste – Helps disperse the heat from CPU to heatsink effectively
• Wide Range of Applications – Suitable for laptop/VGA/Processor/PS4/Chipset and other PC components
• Thermal Conductivity &gt
• 1.63W/m-k
• Easy to Apply – With an ideal consistency, Quick application of the thermal paste with the enclosed spatula, The G104 is very easy to use, Even for beginners
• Large Capacity – 150g large capacity thermal paste

Feature

• GENNEL G107
• Thermal Conductivity: &gt
• 3.17W/m-k Thermal Resistance: &lt
• 0.067°C-in2/W
• High temperature resistance Non-toxic, tasteless, non-corrosive
• Net Weight: 20gram